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So in a post below I mention a low output moving coil taking years to break in a wire.
Is this true?
Does the length of break in time depend on the quantity of electrical signal passing by?
So in effect a low output MC would take years to break in the wires connecting it. Vs a line level signal?
Follow Ups:
No, it does not take years to break in wire used with a low output MC cartridge. As I said in the thread below, I break in wires with line signal whenever I can, but with my tonearm wiring I just hook it up and play the records. Several times when I did this, I kept track of the number of record sides played and based on that I would estimate my tonearm wires took 40 or 50 hours to reach pretty much their final sound quality. It's hard to be precise about this because it takes a month or so of regular listening for me to reach 40-50 hours. In contrast an interconnect can reach that point with just two days of continuous FM or CD play. I could have rigged up a contraption to play line level signals through the tonearm wiring but I never had enough initiative to do this.
To respond to your question more generally, I believe (and this is just speculation) that the break-in of wires is not significantly affected by the amount of voltage or current used in the break-in process. Common sense says that break-in should be faster with more voltage or more current, but in my experience I just haven't noticed any correlation.
Burn-in involves both voltage and current. A phono cartridge involves so little dielectric, that burn-in is not a highly important issue to be concerned about. However, mechanical break-in time is another issue, since the suspension of a stylus may benefit from an extended mechanical break-in period.
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It's often confused that the metallurgy of a wire is what's being affected by burn-in, but it's the dielectric (insulation) of the wire that is going through the burn-in process in terms of its relationship with the conductor. What can affect the metallurgy of a wire is cryo treatment, which better optimizes the grain boundaries of a metals crystalline structure.
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