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As a ridiculed metal worker

I posted that all metals exhibit a grain structure generally running along its length. This is due to the extrusion process in the case of wire or simply the flow of the molten metal as it is poured onto a slab.

If you polish the surface of any metal, you will see the exposed grain structure. The crystalline structure of the metal follows this grain pattern. Bending the metal across the grain ( say 90 degrees) yields a nice bend. Bending a sharp radius along the grain will generally cause the metal to fracture unless a large radius is allowed for.

You can change the metal structure by such processes as annealing or tempering. Cold working the metal also creates noticeable change in the crystalline structure.

Since there is microscopic evidence of this change in the grain structure and the facts of crystallization in metals are very well documented, it stands to reason that the changes in crystallization can have an affect on electrical propagation. After all, it has an effect on the mechanical working of the metal

One of the fundamental basis for cabling theory is the minimization of such crystalline structures. The higher purity metals have larger crystalline structure, as the impurities tend to collect at the edges of the crystalline boundaries. In fact, it is surmised that the impurities themselves create the crystalline edges. The greater or more numerous the crystalline boundaries, therefore, the harder it is for an electrical signal to pass through them without being affected.

Such grain structures are basically everywhere. You notice it even in something like paper. A sheet will tear more easily in direction than the other.

Of course YMMV


Stu


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  • As a ridiculed metal worker - unclestu 21:47:36 01/03/13 (0)


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