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Re: all too familiar...

"The only area to scrape would be the solder joint. No access to the conductor."

The wire slowly oxidizes on the surface inside the plastic insulating jacket. You can't stop it and short of encapsulating it there's nothing you can do to even slow it down. The insulation is probably pourous and will also probably continue to slowly outgas indefinitely. Even after many years, the oxide buildup on the surface is probably so thin it is invisible to the naked eye. The only place it is noticable is at the ends where it is exposed to air.

"I am an equipment maintenance technician in a 200mm DRAM wafer fab."

I built wafer fabs at Signetics in Sunnyvale and Fairchild Semiconductor in Mountainview 25 years ago. They are extraordinarily dangerous places. The standard in those days was about 4 inch diameter wafers.


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