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SSM2017 vs. 2019 vs. INA217 - mic pre. chips

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Ecaroh

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I'm looking to try alternatives in my Graham-Patten A/D converter, which uses two of the obsolete Analog Devices SSM2017 chip, mostly found in mic preamps.
Can anyone comment on whether this is worthwhile in the first place, and on which of the alternative chips (see subject line) might be nicer? The INA is Burr-Brown.
Thanks!
Steve.

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Re: SSM2017 vs. 2019 vs. INA217 - mic pre. chips - Jacques 10:44:00 11/20/04 (1)
> whether this is worthwhile in the first place...
Try it. Just be aware not to forget to check on the layout whether the decoupling RF caps (if any...) are close to the power pins of the IC (I mean less than 2cm). The alternatives, built with thinner and faster technologies, are more sensitive to power sources impedance unbalances in the low RF domain, which can give interstage positive feedback and calls for instablities and oscillations... Ten years ago and before, correct RF decoupling was just considered by middle-end designers as somehow luxuous. In case you foresee a problem, just solder a 0.1uF ceramic or plastic cap directly onto the IC packages between the +15V and the -15V pins.
Anyway, it will be much more performant (however it's likely you will not hear the difference on most of the material), and less power hungry (so, more reliability for the poser supply too). See http://www.electronicstalk.com/news/tex/tex317.html
> on which of the alternative chips (see subject line) might be nicer?
I've been a BurrBrown fan for more than 10 years. I even use flat pack mil-approved ICs from BB in my most remote device, so...
Go ahead for the INA217!
http://focus.ti.com/docs/prod/folders/print/ina217.html
Another alternative worth considering should be available in a few months, the THAT1510.
Currently, it's still just marketing vaporware, but I'm pretty sure it will be on the market someday. See http://www.thatcorp.com/datashts/1510data.pdf for the bright side (the marketers') and http://www.thatcorp.com/relsched.html for the dark side
- http://focus.ti.com/docs/prod/folders/print/ina217.html (Open in New Window)
- Appreciate that, Jacques - Ecaroh 14:32:31 11/20/04 (0)
  Will keep an eye open for the coming 1510. Meanwhile, I'll try to post after experimenting with the BB part, in a week or two.
  Many thanks,
  Steve.
Re: SSM2017 vs. 2019 vs. INA217 - mic pre. chips - Jacques 10:40:11 11/20/04 (0)
> whether this is worthwhile in the first place...
Try it. Just be aware not to forget to check on the layout whether the decoupling RF caps (if any...) are close to the power pins of the IC (I mean less than 2cm). The alternatives, built with thinner and faster technologies, are more sensitive to power sources impedance unbalances in the low RF domain, which can give interstage positive feedback and calls for instablities and oscillations... Ten years ago and before, correct RF decoupling was just considered by middle-end designers as somehow luxuous. In case you foresee a problem, just solder a 0.1uF ceramic or plastic cap directly onto the IC packages between the +15V and the -15V pins.
Anyway, it will be much more performant (however it's likely you will not hear the difference on most of the material), and less power hungry (so, more reliability for the poser supply too). See
> on which of the alternative chips (see subject line) might be nicer?
I've been a BurrBrown fan for more than 10 years. I even use flat pack mil-approved ICs from BB in my most remote device, so...
Go ahead for the INA217!

Another alternative worth considering should be available in a few months, the THAT1510.
Currently, it's still just marketing vaporware, but I'm pretty sure it will be on the market someday. See for the bright side (the marketers') and for the dark side
- http://focus.ti.com/docs/prod/folders/print/ina217.html (Open in New Window)

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