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In Reply to: RE: CMP Hardware Update posted by jackwong96 on November 12, 2011 at 09:50:00
Hi Jack!
May be better to use the motherboard GA-H61N-USB3 if the USB to SPDIF converter is all the same used? Unfortunately the chipset H61 has not support PCI natively.
Serge.
http://cmp2-mihaylov.narod.ru/
My cMP2: Windows XP SP2, Gigabyte GA-H55M-UD2H, Intel Core i3-530, Corsair CM3X160C9DHX 1GB, system drive - Transcend IDE FLASH MODULE TS2GDOM40V-S, ESI Juli@, full linear PSU, NAS - WD My Book Live, iPad
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Hi Serge,
The H61N-USB3 is a good choice too. It has got the same number of power phase, so I guess the sonic quality would be the same as S2v. Since it is very compact, removal of chips will be more difficult. I believe it is more expensive too. If I'm going for a smaller case I would use it.
Jack
You consider that removal of chips is necessary?
Tell please about your refined method of chips removal. It's interesting.
Serge.
http://cmp2-mihaylov.narod.ru/
My cMP2: Windows XP SP2, Gigabyte GA-H55M-UD2H, Intel Core i3-530, Corsair CM3X160C9DHX 1GB, system drive - Transcend IDE FLASH MODULE TS2GDOM40V-S, ESI Juli@, full linear PSU, NAS - WD My Book Live, iPad
The video converter chip is bad for music, it pollutes the music source when being played and removal makes a difference. The pollution is more obvious in H55 UD2H board. Removal of other unnecessary chip will reduce current consumption.
Tools:
- 1 hot air gun,1200-1500W
- 1 butane soldering iron with hot air blow, medium to big size
- 1 name card or similar, cut into a long strip to about the size of the chip. This is for removal of chips. The handle can be bigger for ease of holding. Alternatively,cutting one tip of the card to the size of the chip, you can hold the card and use the tip for removal.
- 1 insulating glove, e.g. cotton, for the hand holding the above paper during removal
- 1 sharp nose pliers
- 1 soldering iron
Method:
Preparation
- Removal bigger components that is likely to obstruct removal of chips, e.g capacitors and connecting pins.
- The motherboard is placed up side down on a table, preferably with a big heat sink mounted so that the board can sit on the table. A clearance between the table and the board is required.
- Using the hot air gun, heat up the soldering points of the big component AT CLOSE DISTANCE. Most components including connecting pins can be removed by the hot air gun. Use a pliers to pull out the big components.
- a soldering iron may be needed for removal of capacitors.
Removal of Chips
1. Ignite the gas soldering iron for standby.
2. Put the board on the edge of a work table, top facing upward, with the area at the back of the chip outside the table. Put something heavy on top of the board to hold it in place
3. Using the hot air gun and turn to maximum power, heat up the back of the motherboard from underneath, pointing directly at the chip location. Heat up the board for about 1 minute or more.
4. With the hot air gun still heating up the back of the board from below, with your hand blow the gas soldering iron directly at the chip. If you're on your own, you will need to hold the hot air gun in place with your thighs.
5. Blow the gas soldering iron at the chip at close distance for about 20 to 30 seconds(timing varies depending on the power)
6. Use the other hand to hold the name card or strip of paper. Push the chip away or towards a safe direction
7. After removal, stop using the hot air gun and continue to blow the gas solder iron towards the resistors and small components for removal, if necessary.
8. Gain confidence by practicing removal works using an unused motherboard.
Jack
-
Serge.
http://cmp2-mihaylov.narod.ru/
My cMP2: Windows XP SP2, Gigabyte GA-H55M-UD2H, Intel Core i3-530, Corsair CM3X160C9DHX 1GB, system drive - Transcend IDE FLASH MODULE TS2GDOM40V-S, ESI Juli@, full linear PSU, NAS - WD My Book Live, iPad
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